XCKU060-2FFVA1517I 20nm proses altında sistemin performansı və inteqrasiyası üçün optimallaşdırılıb və tək çip və yeni nəsil yığılmış silikon interconnect (SSI) texnologiyasını qəbul edir. Bu FPGA həm də gələcək nəsil tibbi görüntüləmə, 8k4k video və heterojen simsiz infrastruktur üçün tələb olunan DSP intensiv emal üçün ideal seçimdir.
XCKU060-2FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
Functional characteristics
Improve system performance
6.3 TeraMAC's DSP Computing Performance
The system level performance per watt is more than twice that of the Kindex-7 FPGA
Supports 16G and 28G backplane transceivers
Medium speed 2666 Mb/s DDR4
Total power consumption reduction
Compared to the previous generation of products, power consumption can be reduced by up to 40%
Implementing fine-grained clock gating similar to ASIC clock function through UltraScale devices
Enhanced system logic unit packaging reduces dynamic power consumption
Accelerate design efficiency
Script and Virtex ® UltraScale device compatibility for scalability
With Vivado ® Collaborative optimization of design suites for quick completion of design
